欧美av蜜桃一区二区蜜桃,国产人成视频在线观看,国产偷人爽久久久久久老妇app,乳欲人妻办公室奶水在线电影国产

Your Position: Home > Support > Service Center

Microsoft joined a new generation of DRAM groups of HMCC reason

2012/8/16      view:

  In May 8, 2012, promote the use of TSV ( TSV ) 3D laminated to a new generation of DRAM " Hybrid Memory Cube ( HMC ) Hybrid Memory Cube Consortium " popularity ( HMCC ) announced that the United States, software giant Microsoft has joined the association.

  HMC is the three-dimensional structure, the logic chip along the vertical direction superposition of multiple DRAM chips, and then through the TSV connection wiring technology. HMC 's biggest characteristic is compared with existing DRAM, performance can be greatly improved. The reasons there are two, one is between chips from semiconductor package wiring distance on a board on the traditional methods of " cm " units are substantially reduced to dozens ofμ m~ 1mm; two is on a chip to form 1000 to tens of thousands of TSV, realize the multipoint connection chip.

  Microsoft 's accession to the HMCC, because we are considering how to corresponding is likely to become a personal computer and a computer to improving the performance of " memory bottleneck " problem. Memory bottleneck refers to as the microprocessor performance through multiple nucleation and constantly improve, the architecture of the DRAM performance will not be able to meet the need of processor. If do not solve this problem, can occur even if the computer new product, the actual performance is also not appropriate promotion situation. Compared with it, if the TSV based on the application of HMC in computer main memory, the data transmission speed can be increased to the current DRAM is about 15 times, therefore, is not just a giant Microsoft, American companies such as Intel are also active in research using HMC.

  In fact, plans to use TSV not only for HMC and other DRAM products. According to the semiconductor manufacturers plan, in the next few years, borne from electronic equipment input function of the CMOS sensor to the responsible for the operations of FPGA and multi core processor, and in charge of product storage of DRAM and NAND flash will have to import TSV. If the plan goes ahead, TSV will assume the input, operation, storage and other electronic equipment main function.

啊灬啊别停灬用力啊爷小说| 免费观看又色又爽又黄的| 97久久精品亚洲中文字幕无码| 永久免费的啪啪网站免费观看浪潮| 国产成人a人亚洲精v品无码| 用舌头去添高潮无码视频| 国产偷亚洲偷欧美偷精品| 蜜芽无码亚洲资源网站| 麻豆一区二区99久久久久| 斗破苍穹年番在线观看免费| 久久99精品国产自在现线小黄鸭| 18一20亚洲gay无套| 99久久精品免费看国产| 日本三级片在线观看| 国产精品久久久久久人妻| 色噜噜狠狠色综合av| 含着奶头搓揉深深挺进p漫画| 扒开美女内裤狂揉下部| 999热线在线观看| 国语自产偷拍精品视频偷拍图片| 极品粉嫩国产18尤物在线播放| 色哟哟视频免费入口在线看| 在线视频| 久久婷婷五夜综合色啪软件下| 夹得好湿真拔不出来了动态图| 久久精品国产亚洲av无码麻豆| 精品无人区一区二区三区| 吃奶揉捏奶头高潮视频在线观看| 无码人妻一区二区三区免费n鬼沢| 欧美97色伦欧美一区二区日韩| 日韩精品一区二区三区四区蜜桃| 免费中国帅气体育生gary| 女人与公拘交酡过程| 女人野外做爰a片妓女| 免费人成视频x8x8入口观看大| 最近中文字幕在线看免费完整版| 亚洲香蕉成人av网站在线观看| 无人区一码二码三码四码区| 当着全班面被c到高潮哭视频| 日本无码视频| 护士张开腿被奷日出白浆|